COOLSPAN TECA is a silver-filled epoxy adhesive film that forms a thermally and electrically conductive bond. It is relevant to attaching an RF circuit to a metal carrier or heat-spreading structure. Its conductive role makes it fundamentally different from dielectric bondply used between isolated signal and ground layers.
Material system
Silver-filled epoxy adhesive film
Technical properties
| Property | Reported value | Conditions / source |
|---|---|---|
| Thermal conductivity | 6 W/(m·K) | Typical cured free film, Z axis; laser flash method. Temperature is not stated in the product table; this is film conductivity, not bonded interface conductance. Source |
Typical reported values are not a purchase specification. Process Dk, design Dk and values measured at different frequencies are not interchangeable.
Selection and design notes
- Consider it when the design requires both thermal transfer and an electrical connection across the bond interface. Confirm that the bonded surfaces are intended to be at the same electrical potential; the adhesive must not be used where insulation is required.
- A thermal model should include adhesive thickness, voids, contact area and carrier behavior. The free-film conductivity does not directly predict the conductance of a real bonded interface.
Thickness and copper options
Standard film thicknesses include 2 and 4 mil. Finished bondline and void control need assembly-specific verification.
No copper-clad core is supplied by this record. Copper and metal surfaces must be prepared for the conductive adhesive interface.
Fabrication considerations
- The product guidance gives alternative cure schedules measured at the adhesive and emphasizes pressure distribution, planarity and moisture control. Select and qualify a schedule with representative parts rather than treating a press or oven setpoint as proof of cure.
Application fit
- RF-board metal-carrier attachment
- Conductive thermal bondlines
- Heat-spreader bonding
Limits and substitution checks
- This record is excluded from ordinary dielectric presets. It does not have a useful laminate Dk for insulating transmission-line models. Bond strength and thermal performance also depend on surface preparation and processing, so a conductive film cannot repair an unsuitable mechanical or electrical interface by itself.