Explore circuit materials by the job they must perform: carrying a low-loss signal, holding phase through temperature changes, supporting an antenna, or bonding a multilayer stack. A material name alone does not define a finished PCB.
Start with the material system
Use the family guides to distinguish thermoset laminates, PTFE composites, bonding materials, and specialized magnetic or printable dielectrics. Then open a grade page for its sourced property observations and configuration notes.
Read the conditions with the value
Dk, Df, thermal conductivity and PIM results need their test conditions. A blank property means it has not been established here; it is not a zero. Begin with the selection workflow, narrow candidates in the material selector, and confirm the exact thickness and copper construction before design release.
Explore the materials library
familyRO4000 Material Family: Selection GuideThe RO4000 family brings together hydrocarbon ceramic circuit laminates and associated multilayer materials.familyRO3000 / RO3200 Material Family: Selection GuideRO3000 materials use ceramic-filled PTFE; the related RO3200 range adds woven-glass reinforcement.familyRT/duroid Material Family: Selection GuideRT/duroid covers multiple filled-PTFE constructions rather than one universal microwave substrate.familyTMM Material Family: Selection GuideTMM is a thermoset microwave family with several dielectric-constant options.familyTC Material Family: Selection GuideTC laminates combine PTFE, woven fiberglass and thermally conductive ceramic filler.familyAD Material Family: Selection GuideAD materials provide PTFE-based options for antenna and other RF boards.familyIM Material Family: Selection GuideIM variants extend selected AD and DiClad materials with a construction intended for antenna performance, including low PIM.familyCLTE Material Family: Selection GuideCLTE materials use ceramic-filled PTFE with woven-glass reinforcement.familyCuClad Material Family: Selection GuideCuClad laminates are woven-fiberglass-reinforced PTFE composites.familyDiClad Material Family: Selection GuideDiClad is a fiberglass-reinforced PTFE family for high-frequency circuit substrates.familyIsoClad Material Family: Selection GuideIsoClad uses non-woven fiberglass reinforcement in PTFE.familyAnteo Material Family: Selection GuideAnteo is a glass-reinforced hydrocarbon thermoset material positioned for designs transitioning from FR4 when better controlled RF behavior is needed.familyKappa Material Family: Selection GuideKappa 438 is a glass-reinforced hydrocarbon thermoset laminate associated with FR4-like design transitions.familyMAGTREX Material Family: Selection GuideMAGTREX materials require both magnetic and dielectric properties in the design model.familyRadix Material Family: Selection GuideRadix is a printable dielectric material platform for three-dimensional RF structures.familyXtremeSpeed RO1200 Material Family: Selection GuideXtremeSpeed RO1200 includes laminates and bondplys intended for high-speed designs.familyBonding Materials Material Family: Selection GuideBonding materials join the layers or attach a circuit to a support, but their roles differ.materialRO4003C: Properties, Uses & Design NotesRO4003C is a glass-reinforced thermoset laminate for microwave interconnects, filters and matching networks where low dielectric loss and familiar PCB…materialRO4350B: Properties, Uses & Design NotesRO4350B combines the RO4000 thermoset processing approach with a flame-retardant formulation.materialRO4000 LoPro: Properties, Uses & Design NotesRO4000 LoPro identifies a smooth reverse-treated copper construction used with several RO4000 laminates, rather than one dielectric formulation with a…materialRO4360G2: Properties, Uses & Design NotesRO4360G2 is a higher-permittivity thermoset option for designers who want more compact distributed RF features while retaining the RO4000 processing route.materialRO4533: Properties, Uses & Design NotesRO4533 is an antenna-oriented thermoset laminate with a lower nominal process Dk than RO4534.materialRO4534: Properties, Uses & Design NotesRO4534 occupies a neighboring antenna-design point to RO4533, with a somewhat higher nominal dielectric constant and a distinct thickness offering.materialRO4535: Properties, Uses & Design NotesRO4535 appears in Rogers' selector as the flame-retardant member of the RO4500 antenna family.materialRO4725JXR: Properties, Uses & Design NotesRO4725JXR provides a relatively low dielectric constant within a thermoset antenna-material platform.materialRO4730G3: Properties, Uses & Design NotesRO4730G3 is a flame-retardant antenna laminate in the RO4700 group with a nominal process Dk around three.materialRO4830: Properties, Uses & Design NotesRO4830 is a spread-glass thermoset laminate documented in the selector for millimeter-wave work.materialRO4830 Plus: Properties, Uses & Design NotesRO4830 Plus is a woven-glass-free thermoset laminate intended for thin millimeter-wave RF layers.materialRO4835: Properties, Uses & Design NotesRO4835 is a hydrocarbon thermoset laminate developed with improved resistance to oxidative aging.materialRO4835T: Properties, Uses & Design NotesRO4835T extends the RO4835 concept into thin spread-glass constructions for multilayer RF designs.materialRO4835IND LoPro: Properties, Uses & Design NotesRO4835IND LoPro is a specific thin thermoset construction for short-range industrial radar in the 60–81 GHz region.materialRO3003: Properties, Uses & Design NotesRO3003 is a ceramic-filled PTFE laminate used where low dielectric loss and a relatively stable temperature response are useful in RF and millimeter-wave…materialRO3003G2: Properties, Uses & Design NotesRO3003G2 is a ceramic-filled PTFE development targeted at thin millimeter-wave circuits, with a refined filler system and VLP ED copper.materialRO3006: Properties, Uses & Design NotesRO3006 is a ceramic-filled PTFE laminate with higher permittivity than RO3003 or RO3035.materialRO3010: Properties, Uses & Design NotesRO3010 is the high-permittivity member of the commonly used ceramic-filled RO3000 PTFE group.materialRO3035: Properties, Uses & Design NotesRO3035 offers an intermediate dielectric constant within the ceramic-filled RO3000 PTFE family.materialRO3203: Properties, Uses & Design NotesRO3203 adds woven-glass reinforcement to a ceramic-filled PTFE system in the lower-Dk region of the RO3200 group.materialRO3206: Properties, Uses & Design NotesRO3206 combines a higher-Dk ceramic-filled PTFE dielectric with woven-glass reinforcement.materialRO3210: Properties, Uses & Design NotesRO3210 is the high-Dk, woven-glass-reinforced member of the RO3200 group.materialRT/duroid 5280LZ: Properties, Uses & Design NotesRT/duroid 5280LZ is a low-Dk PTFE laminate with woven-glass construction options.materialRT/duroid 5870: Properties, Uses & Design NotesRT/duroid 5870 uses random glass fibers in PTFE and provides a slightly higher dielectric constant than RT/duroid 5880.materialRT/duroid 5880: Properties, Uses & Design NotesRT/duroid 5880 is a random-glass-fiber PTFE laminate frequently considered for low-loss microwave and antenna structures.materialRT/duroid 5880LZ: Properties, Uses & Design NotesRT/duroid 5880LZ is a filled PTFE composite with low dielectric constant and reduced density.materialRT/duroid 6002: Properties, Uses & Design NotesRT/duroid 6002 is a ceramic-filled PTFE laminate with moderate permittivity, relatively low thermal expansion and a small positive dielectric temperature…materialRT/duroid 6006: Properties, Uses & Design NotesRT/duroid 6006 is a higher-permittivity ceramic-filled PTFE laminate for compact microwave structures.materialRT/duroid 6010.2LM: Properties, Uses & Design NotesRT/duroid 6010.2LM is a high-permittivity ceramic-filled PTFE laminate relevant to compact RF structures.materialRT/duroid 6035HTC: Properties, Uses & Design NotesRT/duroid 6035HTC is a ceramic-filled PTFE laminate that combines microwave dielectric performance with improved thermal conduction relative to many…materialRT/duroid 6202: Properties, Uses & Design NotesRT/duroid 6202 is a woven-glass-reinforced, ceramic-filled PTFE laminate with a documented dependence of Dk on core thickness.materialRT/duroid 6202PR: Properties, Uses & Design NotesRT/duroid 6202PR is a reinforced ceramic-filled PTFE laminate associated with planar-resistor constructions.materialTMM 3: Properties, Uses & Design NotesTMM 3 is a ceramic-filled thermoset microwave material at the lower-permittivity end of the TMM family.materialTMM 4: Properties, Uses & Design NotesTMM 4 provides a midrange dielectric constant in the ceramic-filled thermoset TMM family.materialTMM 6: Properties, Uses & Design NotesTMM 6 is a ceramic-filled thermoset grade that moves the TMM family into higher-permittivity microwave design.materialTMM 10: Properties, Uses & Design NotesTMM 10 is a higher-permittivity ceramic-filled thermoset laminate for compact microwave circuitry.materialTMM 10i: Properties, Uses & Design NotesTMM 10i is the isotropic high-permittivity variant in this part of the TMM family.materialTMM 13i: Properties, Uses & Design NotesTMM 13i extends the TMM thermoset family to still higher permittivity for compact microwave structures.materialTC350: Properties, Uses & Design NotesTC350 is a woven-glass-reinforced, ceramic-filled PTFE laminate aimed at RF circuits where dielectric performance and heat transfer both matter.materialTC350 Plus: Properties, Uses & Design NotesTC350 Plus is a reinforced ceramic-filled PTFE development with a higher reported through-thickness thermal conductivity and different dielectric data…materialTC600: Properties, Uses & Design NotesTC600 combines higher permittivity with a thermally enhanced, woven-glass-reinforced PTFE construction.materialAD250C: Properties, Uses & Design NotesAD250C is a woven-glass PTFE antenna laminate in the lower-Dk part of the AD family.materialAD255C: Properties, Uses & Design NotesAD255C is a low-Dk woven-glass PTFE laminate for antenna-oriented RF structures.materialAD300D: Properties, Uses & Design NotesAD300D is a woven-glass PTFE antenna laminate with a moderate dielectric constant.materialAD350A: Properties, Uses & Design NotesAD350A is the higher-permittivity antenna material among the listed AD grades.materialAD255C-IM: Properties, Uses & Design NotesAD255C-IM combines the AD255C PTFE substrate concept with Rogers' IM copper cladding.materialAD300D-IM: Properties, Uses & Design NotesAD300D-IM is the IM-clad version of a moderate-Dk woven-glass PTFE antenna platform.materialDiClad 880-IM: Properties, Uses & Design NotesDiClad 880-IM applies the IM copper construction to a low-Dk woven-glass PTFE antenna substrate.materialCLTE: Properties, Uses & Design NotesCLTE is a reinforced PTFE microwave laminate designed with dimensional and thermal behavior in mind.materialCLTE-AT: Properties, Uses & Design NotesCLTE-AT is a reinforced PTFE antenna and microwave substrate with low in-plane and through-thickness expansion in the published material table.materialCLTE-XT: Properties, Uses & Design NotesCLTE-XT is a low-loss reinforced PTFE material in the CLTE family.materialCLTE-MW: Properties, Uses & Design NotesCLTE-MW is a reinforced PTFE laminate offered in thin constructions for microwave and millimeter-wave interconnects.materialCuClad 217: Properties, Uses & Design NotesCuClad 217 is a cross-plied woven-glass PTFE laminate at the low-Dk end of the CuClad family.materialCuClad 233: Properties, Uses & Design NotesCuClad 233 offers a higher dielectric constant than CuClad 217 within a cross-plied woven-glass PTFE architecture.materialCuClad 250: Properties, Uses & Design NotesCuClad 250 covers a selectable dielectric range in a cross-plied woven-glass PTFE family.materialDiClad 527: Properties, Uses & Design NotesDiClad 527 is a woven-glass PTFE laminate offered over a dielectric-constant range.materialDiClad 870: Properties, Uses & Design NotesDiClad 870 is a woven-glass PTFE laminate with a nominal dielectric constant between DiClad 880 and the higher selectable DiClad 527 range.materialDiClad 880: Properties, Uses & Design NotesDiClad 880 is the low-Dk woven-glass PTFE grade in the DiClad group.materialIsoClad 917: Properties, Uses & Design NotesIsoClad 917 uses nonwoven random-glass reinforcement in PTFE.materialIsoClad 933: Properties, Uses & Design NotesIsoClad 933 is the higher-Dk companion to IsoClad 917 in the nonwoven random-glass PTFE family.materialAnteo: Properties, Uses & Design NotesAnteo is a ceramic-filled, glass-reinforced thermoset laminate positioned for RF designs that need controlled dielectric behavior with a familiar…materialKappa 438: Properties, Uses & Design NotesKappa 438 is a ceramic-filled hydrocarbon thermoset laminate reinforced with woven glass.materialMAGTREX 555: Properties, Uses & Design NotesMAGTREX 555 is a magneto-dielectric thermoplastic composite rather than an ordinary nonmagnetic PCB substrate.materialRadix 2.8Dk Printable Dielectric: Properties, Uses & Design NotesRadix 2.8Dk Printable Dielectric is a photopolymer material for additive manufacture of three-dimensional RF dielectric parts.materialXtremeSpeed RO1200 Laminate: Properties, Uses & Design NotesXtremeSpeed RO1200 laminate is a ceramic-filled PTFE material with spread woven-glass reinforcement for high-speed interconnects.material2929 Bondply: Properties, Uses & Design Notes2929 Bondply is an unreinforced thermoset bonding film for multilayer RF construction.materialCuClad 6250 Bonding Film: Properties, Uses & Design NotesCuClad 6250 is a thermoplastic bonding film used to join PTFE microwave laminates.materialCuClad 6700 Bonding Film: Properties, Uses & Design NotesCuClad 6700 is a thermoplastic bonding film for PTFE microwave constructions, with a higher bonding-temperature regime than CuClad 6250.materialCOOLSPAN TECA: Properties, Uses & Design NotesCOOLSPAN TECA is a silver-filled epoxy adhesive film that forms a thermally and electrically conductive bond.materialRO4450F: Properties, Uses & Design NotesRO4450F is a ceramic-filled, glass-reinforced thermoset bonding material for RO4000 multilayers.materialRO4450T: Properties, Uses & Design NotesRO4450T is a spread-glass, ceramic-filled thermoset bonding material offered in several thin constructions.materialRO4460G2: Properties, Uses & Design NotesRO4460G2 is a higher-Dk ceramic-filled thermoset bonding material in the RO4400 group.materialRO1200 Bondply: Properties, Uses & Design NotesRO1200 Bondply is a ceramic-filled, non-glass-reinforced PTFE bonding material intended for multilayer constructions using the RO1200 laminate platform.materialSpeedWave 300P: Properties, Uses & Design NotesSpeedWave 300P is a low-Dk, glass-reinforced thermoset prepreg available in multiple glass styles and resin contents.materialRO3000 Series Bondply: Properties, Uses & Design NotesRO3000 Series Bondply is an undensified PTFE-based bonding form for homogeneous RO3000 multilayers.materialRO4450B Historical Reference: Properties, Uses & Design NotesRO4450B is retained as a historical reference because the official CU4000 foil compatibility document names it among RO4000 bonding materials.material3001 Bonding Film Historical Reference: Properties, Uses & Design Notes3001 Bonding Film is retained as a historical reference because official RT/duroid fabrication guidance discusses its use in bonding constructions.
Select a construction and verification plan, not just the smallest loss value.