RO1200 Bondply is a ceramic-filled, non-glass-reinforced PTFE bonding material intended for multilayer constructions using the RO1200 laminate platform. It is distinct from the reinforced laminate cores and has its own process and Design Dk. The bondply enables a PTFE-based bonding route rather than an ordinary thermoset cure assumption.
Material system
Ceramic-filled PTFE bondply without glass reinforcement
Technical properties
| Property | Reported value | Conditions / source |
|---|---|---|
| Process dielectric constant | 2.97 | Typical, 10 GHz, 23°C; IPC-TM-650 2.5.5.5 clamped stripline; direction is not separately recorded here. Source |
| Design dielectric constant | 2.99 | Typical; 10 GHz, microstrip differential phase length method, C-24/23/50 conditioning. Source |
| Dissipation factor | 0.0012 | Typical, 10 GHz, 23°C; IPC-TM-650 2.5.5.5; direction is not separately recorded here. Source |
| Thermal conductivity | 0.5 W/(m·K) | Typical; ASTM D5470, 50°C, through-thickness direction. Source |
| CTE, X axis | 29 ppm/°C | Typical; -55°C to 288°C, IPC-TM-650 2.4.41; average expansion over the interval, not necessarily linear. Source |
| CTE, Y axis | 29 ppm/°C | Typical; -55°C to 288°C, IPC-TM-650 2.4.41; average expansion over the interval, not necessarily linear. Source |
| CTE, Z axis | 29 ppm/°C | Typical; -55°C to 288°C, IPC-TM-650 2.4.41; average expansion over the interval, not necessarily linear. Source |
| Water absorption | 0.13 % | Typical; E1/105 + D24/23, IPC-TM-650 2.6.2.1. Source |
Typical reported values are not a purchase specification. Process Dk, design Dk and values measured at different frequencies are not interchangeable.
Selection and design notes
- Consider it when a low-loss PTFE multilayer architecture justifies the necessary high-temperature processing capability. Compare the complete stackup with a compatible thermoset prepreg alternative before deciding how the layers should be bonded.
- For a high-speed channel, use the bondply's dielectric properties where fields occupy the bonding region. Copying the core's Dk into every dielectric layer would hide a documented material difference.
Thickness and copper options
The listed nominal bondply gauges are 2.5, 3.0, 4.0 and 5.0 mil. Select the required ply combination and verify final bonded spacing.
Bondply is unclad. Confirm the adjoining foil and surface-treatment compatibility for the PTFE bonding cycle.
Fabrication considerations
- Require the appropriate RO1200 bonding process and verify that every core, foil treatment and embedded feature tolerates the thermal cycle. Final bondline thickness and registration need validation on the intended copper pattern, not only on flat unpatterned samples.
Application fit
- RO1200 multilayers
- High-speed PTFE stacks
- Low-loss bond regions
Limits and substitution checks
- The selector's approximate press-temperature figure is not a complete manufacturing recipe. Non-glass-reinforced bondply also does not offer the same handling stiffness as the reinforced core. Its low loss does not guarantee finished-channel performance without copper, via and transition modelling.