SpeedWave 300P is a low-Dk, glass-reinforced thermoset prepreg available in multiple glass styles and resin contents. It can bond several Rogers laminate families while supporting a thermoset processing route. The construction table, not a single headline number, defines the relevant dielectric properties for a particular stack.
Material system
Low-Dk glass-reinforced thermoset prepreg; multiple glass styles and resin contents
Technical properties
| Property | Reported value | Conditions / source |
|---|---|---|
| Process dielectric constant | 3.00–3.27 at 10 GHz | Typical construction range at 10 GHz, source construction table page 3; glass styles/resin contents differ. Page 2 example is 3.16 for 1078 glass, 64% resin, 23°C/50% RH. A single universal value is inappropriate. Source |
| Dissipation factor | 0.0019–0.0022 at 10 GHz | Typical construction range, source page 3. Page 2 example is 0.0021 for 1078 glass, 64% resin, 23°C/50% RH. Do not detach Df from glass/resin construction. Source |
Typical reported values are not a purchase specification. Process Dk, design Dk and values measured at different frequencies are not interchangeable.
Selection and design notes
- Consider it where a qualified thermoset bonding process fits a low-loss multilayer architecture. Choose the glass and resin content to fill copper features and achieve the required pressed spacing, then use the matching frequency-dependent dielectric data.
- Two prepregs with the same nominal thickness can have different glass styles and electrical values. Keep the construction code in both the simulation material card and the fabrication stackup.
Thickness and copper options
Listed nominal constructions run from 2.0 to 5.5 mil, with glass style and resin content explicitly associated with each option.
Unclad prepreg; copper roughness and foil compatibility belong to the selected laminate/foil construction.
Fabrication considerations
- Work from the SpeedWave fabrication guidance and verify the copper-fill and flow window with the board manufacturer. Sequential-lamination capability still needs evaluation for the actual number of cycles, material combinations and interconnection structure.
Application fit
- High-speed multilayers
- Millimeter-wave hybrid stacks
- Sequential RF lamination
Limits and substitution checks
- Automatic Dk and Df filling is disabled for this multi-construction record. The source table spans different frequencies and resin contents; choosing its lowest Df with another construction's Dk is not valid. The stated low-temperature CTE also must not be extended above Tg without the separate high-temperature behavior.