RO3206 combines a higher-Dk ceramic-filled PTFE dielectric with woven-glass reinforcement. It is a candidate for compact RF structures where reinforcement is useful for fabrication or mechanical handling. Both its Design Dk and temperature response differ from the nominally similar unreinforced RO3006 grade.
Material system
Ceramic-filled PTFE reinforced with woven glass
Technical properties
| Property | Reported value | Conditions / source |
|---|---|---|
| Process dielectric constant | 6.15 ± 0.15 | Typical, 10 GHz, 23°C; IPC-TM-650 2.5.5.5 clamped stripline; thickness direction. Source |
| Design dielectric constant | 6.6 | Typical, 8–40 GHz; differential phase length method. Average across the common constructions in the cited datasheet. Source |
| Dissipation factor | 0.0027 | Typical, 10 GHz, 23°C; IPC-TM-650 2.5.5.5; thickness direction. Source |
| Thermal conductivity | 0.67 W/(m·K) | Typical; ASTM C518, 80°C; through-thickness thermal conduction. Source |
| CTE, X axis | 13 ppm/°C | Typical; -55°C to 288°C, IPC-TM-650 2.4.41; average expansion over the interval, not necessarily linear. Source |
| CTE, Y axis | 13 ppm/°C | Typical; -55°C to 288°C, IPC-TM-650 2.4.41; average expansion over the interval, not necessarily linear. Source |
| CTE, Z axis | 34 ppm/°C | Typical; -55°C to 288°C, IPC-TM-650 2.4.41; average expansion over the interval, not necessarily linear. Source |
| Thermal coefficient of dielectric constant | -212 ppm/°C | Typical; 0°C to 100°C, IPC-TM-650 2.5.5.5 (modified temperature measurement); 10 GHz. Source |
Typical reported values are not a purchase specification. Process Dk, design Dk and values measured at different frequencies are not interchangeable.
Selection and design notes
- Evaluate it where circuit size and process stability must be balanced. A compact coupler may gain a useful footprint reduction, but its gaps and registration should be tested against the fabricator's actual capability.
- Compare RO3206 and RO3006 using the same electrical topology and environmental range. Their shared 6.15 process Dk does not justify carrying over resonator lengths or thermal compensation unchanged.
Thickness and copper options
Use the RO3206 thickness options and tolerances in the RO3200 datasheet; review conductor spacing after bonding.
Copper type and weight are separate order parameters and must be retained in comparisons with RO3006.
Fabrication considerations
- Specify core orientation, foil and thickness, then confirm drilling and PTFE surface preparation with the fabricator. In a hybrid stackup, assess differential expansion and the suitability of the proposed prepreg instead of assuming all reinforced materials bond similarly.
Application fit
- Compact reinforced RF boards
- Microwave couplers
- High-Dk multilayers
Limits and substitution checks
- The datasheet Design Dk is 6.6 and the Df is not the same as RO3006. This is especially relevant when a long feedline is attached to a compact circuit. High permittivity and reinforcement do not establish acceptable final-board reliability without interconnection and thermal-cycle evidence.