RT/duroid 6002 is a ceramic-filled PTFE laminate with moderate permittivity, relatively low thermal expansion and a small positive dielectric temperature coefficient. It is useful when circuit dimensions and temperature stability must be considered together. Its structure is different from the random-glass RT/duroid 5870 and 5880 materials.
Material system
Ceramic-filled PTFE
Technical properties
| Property | Reported value | Conditions / source |
|---|---|---|
| Process dielectric constant | 2.94 ± 0.04 | Typical, 10 GHz, 23°C; IPC-TM-650 2.5.5.5 clamped stripline; direction is not separately recorded here. Source |
| Design dielectric constant | 2.94 | Typical, 8–40 GHz; differential phase length method. Average across the common constructions in the cited datasheet. Source |
| Dissipation factor | 0.0012 | Typical, 10 GHz, 23°C; IPC-TM-650 2.5.5.5; direction is not separately recorded here. Source |
| Thermal conductivity | 0.6 W/(m·K) | Typical; ASTM C518, 80°C; through-thickness thermal conduction. Source |
| CTE, X axis | 16 ppm/°C | Typical; -55°C to 288°C, IPC-TM-650 2.4.41; average expansion over the interval, not necessarily linear. Source |
| CTE, Y axis | 16 ppm/°C | Typical; -55°C to 288°C, IPC-TM-650 2.4.41; average expansion over the interval, not necessarily linear. Source |
| CTE, Z axis | 24 ppm/°C | Typical; -55°C to 288°C, IPC-TM-650 2.4.41; average expansion over the interval, not necessarily linear. Source |
| Thermal coefficient of dielectric constant | 12 ppm/°C | Typical; 0°C to 100°C, IPC-TM-650 2.5.5.5 (modified temperature measurement); 10 GHz. Source |
Typical reported values are not a purchase specification. Process Dk, design Dk and values measured at different frequencies are not interchangeable.
Selection and design notes
- Consider it for precision RF networks or multilayers where dimensional compatibility and temperature response deserve as much attention as room-temperature loss. Compare the full phase or resonant-frequency drift over the operating range.
- For a mounted RF circuit, inspect the expansion of the laminate, copper and carrier together. A material-level CTE match can reduce one source of stress without eliminating adhesive or mounting effects.
Thickness and copper options
Standard cores include 10, 20, 30 and 60 mil; the datasheet also discusses additional configurations by enquiry.
ED and rolled copper are listed. Match the foil treatment to both the RF model and the carrier/bonding process.
Fabrication considerations
- Use the specific RT/duroid 6002 fabrication guidance for drilling, handling and interconnection preparation. If using a metal carrier or bonding film, specify interface thickness and processing sequence so that the RF and mechanical drawings describe the same assembly.
Application fit
- Precision microwave networks
- Temperature-sensitive RF circuits
- PTFE multilayers
Limits and substitution checks
- Its thermal conductivity is still that of a polymer composite, not a metallic heat spreader. A stable dielectric coefficient also does not account for physical line expansion or connector movement. Temperature-stable circuit behavior must be assessed with geometry and fixtures included.