RT/duroid 6202PR is a reinforced ceramic-filled PTFE laminate associated with planar-resistor constructions. The PR designation matters for both electrical design and ordering: the required resistive foil must still be specified. Its current product sheet also contains thickness-specific Dk values that differ from the selector's simplified summary.
Material system
Filled PTFE with woven-glass reinforcement; construction-specific
Technical properties
| Property | Reported value | Conditions / source |
|---|---|---|
| Dissipation factor | 0.002 | Typical, 10 GHz, 23°C; IPC-TM-650 2.5.5.5; direction is not separately recorded here. Source |
| Thermal conductivity | 0.68 W/(m·K) | Typical; ASTM C518, 80°C; through-thickness thermal conduction. Source |
| Process dielectric constant | 2.90 ± 0.04 at 5/20 mil; 2.98 ± 0.04 at 10 mil | Typical; 10 GHz, 23°C, Z direction, IPC-TM-650 2.5.5.5; product datasheet thickness table. Conflicts with selector summary. Source |
| Thermal coefficient of dielectric constant | 13 ppm/°C | Typical; 0°C to 100°C, IPC-TM-650 2.5.5.5 (modified temperature measurement); 10 GHz. Source |
| Water absorption | 0.1 % | Typical; D24/23, IPC-TM-650 2.6.2.1. Source |
Typical reported values are not a purchase specification. Process Dk, design Dk and values measured at different frequencies are not interchangeable.
Selection and design notes
- Consider it when embedded planar resistors provide a defined RF or packaging benefit. Budget resistor geometry, sheet resistance and fabrication tolerance as part of the circuit rather than treating the laminate name as a complete resistor specification.
- For a resistor network, check how etching and lamination affect the actual resistance. Use the documented foil grade and production test plan instead of a generic ohms-per-square assumption.
Thickness and copper options
Standard listed thicknesses include 10 and 20 mil. Use the product's thickness-specific electrical table when evaluating other variants.
Order the exact resistive foil separately where needed; copper-only cladding must not be assumed to include a resistor layer.
Fabrication considerations
- Coordinate the resistive-foil process with the fabricator before routing. The copper and resistor layers have different patterning and verification needs, and coupon structures should represent both RF transmission and resistor acceptance.
Application fit
- Embedded resistor RF boards
- Planar resistor networks
- Precision microwave assemblies
Limits and substitution checks
- The product datasheet gives 2.90 for certain thicknesses and 2.98 for the 10 mil construction; selector summaries differ. Automatic Dk entry is withheld. This material is not a direct substitute for ordinary 6202, and catalogue discussion of planar resistors does not guarantee every sheet-resistance option is currently supplied.