TC600 combines higher permittivity with a thermally enhanced, woven-glass-reinforced PTFE construction. It can be considered where compact RF structures and dielectric heat transfer are both useful. Its thermal data explicitly distinguish through-thickness conduction from in-plane conduction, which is important when a model assumes a direction.
Material system
Ceramic-filled PTFE reinforced with woven glass
Technical properties
| Property | Reported value | Conditions / source |
|---|---|---|
| Process dielectric constant | 6.15 | Typical, 10 GHz, 23°C; IPC-TM-650 2.5.5.5 clamped stripline; direction is not separately recorded here. Source |
| Dissipation factor | 0.002 | Typical, 10 GHz, 23°C; IPC-TM-650 2.5.5.5; direction is not separately recorded here. Source |
| Thermal conductivity | 1.1 W/(m·K) | Typical; ASTM E1461, through-thickness direction; test temperature not specified in the product table. Source |
Typical reported values are not a purchase specification. Process Dk, design Dk and values measured at different frequencies are not interchangeable.
Selection and design notes
- Evaluate it for compact power matching or filtering when a higher-Dk layout still has acceptable conductor widths and gaps. The geometry can alter current density and copper heating, so a smaller circuit is not automatically easier to cool.
- Use the Z-axis conductivity for a simple heat path through the substrate. An in-plane number belongs in a model that actually includes lateral conduction and the corresponding boundary conditions.
Thickness and copper options
Select the TC600-specific thickness and tolerance; compare thermal paths using the same thickness and area.
Copper type, weight and any metal backing must be specified separately from the TC600 dielectric name.
Fabrication considerations
- Coordinate drilling, plating and any carrier attachment with a fabricator experienced in filled PTFE. Define the bond interface and copper distribution before comparing temperature measurements with a simulation.
Application fit
- Compact RF power networks
- Microwave filters
- Thermally enhanced matching circuits
Limits and substitution checks
- The listed 1.1 W/(m·K) Z-axis value comes from ASTM E1461, while other RF laminates use D5470 or C518. Avoid ranking unlike methods as if they were one measurement series. The higher Dk also means a TC350 design cannot be transferred without electrical redesign.