IsoClad 917 uses nonwoven random-glass reinforcement in PTFE. That architecture is relevant to applications where a circuit may need to conform to a curved surface, but forming capability depends on the complete copper and dielectric construction. The current datasheet lists more than one low-Dk variant under the product family.
Material system
Nonwoven random-glass-fiber-reinforced PTFE
Technical properties
| Property | Reported value | Conditions / source |
|---|---|---|
| Dissipation factor | 0.0013 | Typical, 10 GHz, 23°C; IPC-TM-650 2.5.5.5; direction is not separately recorded here. Source |
| Thermal conductivity | 0.263 W/(m·K) | Typical; ASTM E1225, 100°C. Source |
| Process dielectric constant | 2.17 or 2.20 | Typical; 10 GHz, C23/50, IPC-TM-650 2.5.5.5; two variants listed in product datasheet. Source |
Typical reported values are not a purchase specification. Process Dk, design Dk and values measured at different frequencies are not interchangeable.
Selection and design notes
- Consider it for a conformal antenna study when the mechanical shape is part of the RF design. Evaluate bend radius, copper strain and mounting pressure together; choosing a nonwoven substrate does not establish a universal safe bend limit.
- A flat RF coupon is useful for material characterization, while the final curved structure is needed to understand radiation and coupling. Keep those two validation tasks separate.
Thickness and copper options
Select thickness against both electrical spacing and the intended forming operation; obtain a verified mechanical process window.
Copper type and thickness influence forming strain and RF loss. Specify both before assessing a curved construction.
Fabrication considerations
- Ask the fabricator to review forming sequence, copper orientation and PTFE hole preparation for the actual thickness. Establish whether the board is formed once or experiences repeated motion, because those uses impose different mechanical demands.
Application fit
- Conformal antennas
- Curved RF structures
- Nonwoven PTFE circuits
Limits and substitution checks
- Do not market IsoClad 917 as a qualified dynamic-flex system without supporting evidence. Its current product sheet includes 2.17 and 2.20 variants, so automatic Dk is withheld. Thermal conductivity is measured by ASTM E1225 at 100°C and cannot be compared as if it were the selector's generic test.