Anteo is a ceramic-filled, glass-reinforced thermoset laminate positioned for RF designs that need controlled dielectric behavior with a familiar fabrication route. It is useful to consider when moving from a specified FR4 construction, but the transition should be driven by the channel or circuit requirement rather than a blanket frequency rule.
Material system
Ceramic-filled hydrocarbon thermoset reinforced with woven glass
Technical properties
| Property | Reported value | Conditions / source |
|---|---|---|
| Process dielectric constant | 4.07 ± 0.08 | Typical; 10 GHz, 23°C/50% RH; IPC-TM-650 2.5.5.5 clamped stripline; direction is not separately recorded here. Source |
| Design dielectric constant | 4.38 | Typical; 10 GHz, microstrip differential phase length method, C-24/23/50 conditioning. Source |
| Dissipation factor | 0.005 | Typical; 10 GHz, 23°C/50% RH; IPC-TM-650 2.5.5.5; direction is not separately recorded here. Source |
| Thermal conductivity | 0.64 W/(m·K) | Typical; ASTM D5470, 80°C, through-thickness direction. Source |
| Thermal coefficient of dielectric constant | -21 ppm/°C | Typical; -50°C to 150°C, IPC-TM-650 2.5.5.5 (modified temperature measurement); 10 GHz. Source |
| Water absorption | 0.07 % | Typical; D24/23, IPC-TM-650 2.6.2.1. Source |
Typical reported values are not a purchase specification. Process Dk, design Dk and values measured at different frequencies are not interchangeable.
Selection and design notes
- Compare Anteo with the actual FR4 grade, resin content and thickness being used. A generic FR4 dielectric number is too vague to establish a meaningful impedance or loss improvement.
- Its current datasheet gives a 4.07 ±0.08 internal process-test value and a separate Design Dk of 4.38 at 10 GHz. Preserve those conditions when retuning a line or resonant structure.
Thickness and copper options
The datasheet lists several cores from 20 to 120 mil. Select the actual thickness and tolerance against the target geometry.
Standard ED foil is listed; smoothness and loss depend on the ordered copper, not the thermoset family name alone.
Fabrication considerations
- Review the laminate's thermoset fabrication guidance with the board manufacturer, including drilling and the intended hybrid bonding material. Verify a representative impedance or loss coupon so that any material benefit can be separated from a change in copper and finish.
Application fit
- RF transitions from FR4
- Controlled-impedance boards
- Cost-sensitive microwave networks
Limits and substitution checks
- The selector's older process Dk and moisture values differ from the currently retrieved product sheet. Anteo should not be treated as identical to Kappa 438 merely because some headline properties resemble one another. A material substitution still requires construction, availability and electrical review.