Radix 2.8Dk Printable Dielectric is a photopolymer material for additive manufacture of three-dimensional RF dielectric parts. It is not a conventional copper-clad circuit-board core. Its solid-material dielectric observations can support lens or loading-element studies, while lattice geometry creates a different effective electromagnetic structure.
Material system
Photopolymer resin for dielectric additive manufacturing
Technical properties
| Property | Reported value | Conditions / source |
|---|---|---|
| Process dielectric constant | 2.8 | Typical; 10 GHz, 23°C/50% RH; IPC-TM-650 2.5.5.5 clamped stripline; direction is not separately recorded here. Source |
| Dissipation factor | 0.0043 | Typical; 10 GHz, 23°C/50% RH; IPC-TM-650 2.5.5.5; direction is not separately recorded here. Source |
| Thermal conductivity | 0.3 W/(m·K) | Typical; ASTM D5470, 50°C, through-thickness direction. Source |
| Process dielectric constant | 2.8 | Typical solid printed specimen, 24 GHz, 23°C/50% RH, Z direction; IPC-TM-650 2.5.5.5. Print/post-cure recipe is not specified in this datasheet table. Source |
| Dissipation factor | 0.0046 | Typical solid printed specimen, 24 GHz, 23°C/50% RH, Z direction; IPC-TM-650 2.5.5.5. Source |
| Water absorption | 0.08 % | Typical; D24/23, ASTM D570; printed solid specimen. Source |
Typical reported values are not a purchase specification. Process Dk, design Dk and values measured at different frequencies are not interchangeable.
Selection and design notes
- Consider it for gradient-index lenses, antenna loading or prototypes whose three-dimensional form is difficult to make from sheet material. Model the actual solid fraction and cell geometry rather than assigning the bulk 2.8 value to every printed lattice.
- A printed structure needs checks of dimensions, surface quality and RF response after the intended post-processing. The useful manufacturing freedom does not remove tolerance or environmental requirements.
Thickness and copper options
Thickness is a printed geometry, not a stocked laminate core. Minimum features and post-process dimensions require process qualification.
No standard copper cladding is specified. Any metallization or attachment process is a separate engineering development.
Fabrication considerations
- Use the printer and material process approved for the chosen resin. Record print orientation, exposure, cleaning and post-cure conditions, then test representative specimens; the publicly retrieved datasheet does not provide a complete validated print/post-cure recipe.
Application fit
- Gradient-index lenses
- Three-dimensional antennas
- Dielectric matching structures
Limits and substitution checks
- No ordinary laminate preset is provided. The published table describes solid printed specimens in a stated direction at 10 and 24 GHz, not arbitrary lattice effective Dk. The reported heat-deflection behavior also does not authorize standard PCB reflow or a copper-clad fabrication process.