AD300D-IM is the IM-clad version of a moderate-Dk woven-glass PTFE antenna platform. It is relevant where PIM control and a dielectric constant near three are needed together. The IM datasheet lists paired process and Design Dk values, so the ordered dielectric construction must be selected before assigning a scalar model.
Material system
Woven-glass-reinforced PTFE with IM copper cladding
Technical properties
| Property | Reported value | Conditions / source |
|---|---|---|
| Dissipation factor | 0.0021 | Typical; 10 GHz, 23°C/50% RH; IPC-TM-650 2.5.5.5; direction is not separately recorded here. Source |
| Thermal conductivity | 0.37 W/(m·K) | Typical, through thickness; ASTM D5470. The product table does not state test temperature. Source |
| Process dielectric constant | 2.97 or 3.03 | Typical; 10 GHz, 23°C/50% RH, IPC-TM-650 2.5.5.5; construction-dependent pair in IM datasheet; most table properties measured on 60 mil laminate. Source |
| Design dielectric constant | 2.95 or 3.01 | Typical; 10 GHz, C-24/23/50, microstrip differential phase length method; select the ordered construction. Source |
| CTE, X axis | 24 ppm/°C | Typical; -55°C to 288°C, IPC-TM-650 2.4.41; average expansion over the interval, not necessarily linear. Source |
| CTE, Y axis | 23 ppm/°C | Typical; -55°C to 288°C, IPC-TM-650 2.4.41; average expansion over the interval, not necessarily linear. Source |
| CTE, Z axis | 98 ppm/°C | Typical; -55°C to 288°C, IPC-TM-650 2.4.41; average expansion over the interval, not necessarily linear. Source |
| Thermal coefficient of dielectric constant | -73 ppm/°C | Typical; 0°C to 100°C, IPC-TM-650 2.5.5.5 (modified temperature measurement); 10 GHz. Source |
| Water absorption | 0.04 % | Typical; E1/105 + D48/50, IPC-TM-650 2.6.2.1; 60 mil reference construction. Source |
Typical reported values are not a purchase specification. Process Dk, design Dk and values measured at different frequencies are not interchangeable.
Selection and design notes
- Use it for an antenna platform that needs the geometry of AD300D and the documented IM foil approach. Compare radiators and feeds with the intended copper and finish, rather than assuming a base AD300D layout remains electrically identical.
- The paired process values 2.97/3.03 correspond to a design pair 2.95/3.01 in the IM table. Obtain the specific construction mapping from the supplier before using one of those numbers.
Thickness and copper options
The IM sheet lists 30 and 60 mil cores, with property-table values generally based on 60 mil material.
Dedicated 35 µm IM ED copper is the defining construction feature; do not substitute a generic VLP foil by name alone.
Fabrication considerations
- Control foil handling, etching and cleanliness along with normal PTFE fabrication requirements. A representative antenna or feed coupon should include the same soldered or mechanical transitions that will exist in production, since those contacts can dominate PIM.
Application fit
- Low-PIM base-station arrays
- Moderate-Dk antenna feeds
- Printed RF distribution
Limits and substitution checks
- The manufacturer PIM test is construction- and fixture-dependent. It does not guarantee the assembled antenna result, nor does the smoothness metric alone establish insertion loss. Automatic Dk filling is withheld because the paired dielectric variants cannot be resolved from the generic product name.