DiClad 880 is the low-Dk woven-glass PTFE grade in the DiClad group. It is available with distinct nominal dielectric variants and should not be reduced to an unspecified single number. Its reinforced construction also distinguishes it from random-glass PTFE materials with a similar dielectric constant.

Material system

Woven-glass-reinforced PTFE

Technical properties

DiClad 880 — reported properties and conditions
PropertyReported valueConditions / source
Dissipation factor0.0009Typical, 10 GHz, 23°C; IPC-TM-650 2.5.5.5; direction is not separately recorded here. Source
Thermal conductivity0.25 W/(m·K)Typical; ASTM E1461, through-thickness direction; test temperature not specified in the product table. Source
Process dielectric constant2.17 or 2.20Typical; 10 GHz, 23°C/50% RH, IPC-TM-650 2.5.5.5; ordered Dk variant must be specified. Source

Typical reported values are not a purchase specification. Process Dk, design Dk and values measured at different frequencies are not interchangeable.

Selection and design notes

  • Consider it for antenna feeds or low-loss RF structures where the required footprint fits a low-permittivity substrate. Select the 2.17 or 2.20 variant before setting dimensions and tolerances.
  • If the application needs IM cladding for PIM control, use the separate DiClad 880-IM dataset and process agreement. The base grade's mechanical and thermal observations are not automatically the same as the IM construction.

Thickness and copper options

Confirm the ordered Dk variant, core thickness and tolerance together. Do not substitute another nominal variant silently.

Standard and IM claddings are different products for modelling and qualification purposes.

Fabrication considerations

  • Agree laminate orientation, thickness and PTFE drill preparation with the fabricator. For a large antenna panel, confirm dimensional compensation and handling, then measure representative lines in the intended direction and foil construction.

Application fit

  • Low-loss antenna feeds
  • Low-Dk radiators
  • Microwave PTFE boards

Limits and substitution checks

  • No automatic Dk is selected because the generic grade names multiple variants. A low Df does not erase the effects of copper roughness or assembly contacts. A change to rolled, reverse-treated or IM foil needs a complete construction review rather than a bare copper-weight substitution.

Technical sources