RO3000 Series Bondply is an undensified PTFE-based bonding form for homogeneous RO3000 multilayers. The source covers RO3003, RO3006 and RO3010 bondply grades with different dielectric properties. It should not be mistaken for one adhesive with the same Dk regardless of which core family it accompanies.
Material system
Undensified ceramic-filled PTFE bondply; RO3003, RO3006 and RO3010 variants
Technical properties
| Property | Reported value | Conditions / source |
|---|---|---|
| Process dielectric constant | 3.00 ±0.04 / 6.15 ±0.15 / 10.2 ±0.30 | Typical, respectively RO3003 / RO3006 / RO3010 bondply after bonding; 10 GHz, 23°C, Z direction, IPC-TM-650 2.5.5.5. This record covers three bondply grades. Source |
| Dissipation factor | 0.0010 / 0.0020 / 0.0022 | Typical for bonded RO3003 / RO3006 / RO3010 respectively; 10 GHz, 23°C, Z direction, IPC-TM-650 2.5.5.5. Source |
Typical reported values are not a purchase specification. Process Dk, design Dk and values measured at different frequencies are not interchangeable.
Selection and design notes
- Consider it when a homogeneous PTFE dielectric stack and its electrical benefits justify high-temperature bonding equipment and process control. Select the actual bondply grade, then model its properties after bonding rather than as an uncured film.
- The guide describes improved registration and copper encapsulation relative to core-to-core fusion approaches, but the practical benefit depends on the board pattern and press process. Evaluate it with the fabricator's actual stack.
Thickness and copper options
The source describes densification to roughly 5 mil, subject to grade and bonding conditions; confirm final spacing with engineering support.
Bondply is unclad. Surface treatment for high-temperature bonding must follow this process, not generic PTFE hole-activation instructions.
Fabrication considerations
- Follow the specific inner-layer preparation and thermal-cycle guidance. The document explicitly distinguishes compatible copper roughening from additive oxides and advises avoiding PTFE activation before this bonding operation. Those instructions are not a substitute for plated-hole preparation at another process stage.
Application fit
- Homogeneous RO3000 multilayers
- PTFE fusion-style bonding
- High-Dk PTFE stacks
Limits and substitution checks
- No scalar preset is supplied because the record contains three dielectric grades. The approximate final thickness described in the guide does not guarantee every copper-patterned bondline. Obtain grade-specific design and processing support before treating the construction as electrically or mechanically homogeneous.