RO3006 is a ceramic-filled PTFE laminate with higher permittivity than RO3003 or RO3035. It gives designers a way to shorten distributed electrical structures without moving all the way to the very high Dk of RO3010. The material choice is particularly sensitive to the circuit's allowed frequency drift with temperature.
Material system
Ceramic-filled PTFE
Technical properties
| Property | Reported value | Conditions / source |
|---|---|---|
| Process dielectric constant | 6.15 ± 0.15 | Typical, 10 GHz, 23°C; IPC-TM-650 2.5.5.5 clamped stripline; thickness direction. Source |
| Design dielectric constant | 6.5 | Typical, 8–40 GHz; differential phase length method. Average across the common constructions in the cited datasheet. Source |
| Dissipation factor | 0.002 | Typical, 10 GHz, 23°C; IPC-TM-650 2.5.5.5; thickness direction. Source |
| Thermal conductivity | 0.79 W/(m·K) | Typical; ASTM D5470, 50°C, through-thickness direction. Source |
| CTE, X axis | 17 ppm/°C | Typical; -55°C to 288°C, IPC-TM-650 2.4.41; average expansion over the interval, not necessarily linear. Source |
| CTE, Y axis | 17 ppm/°C | Typical; -55°C to 288°C, IPC-TM-650 2.4.41; average expansion over the interval, not necessarily linear. Source |
| CTE, Z axis | 24 ppm/°C | Typical; -55°C to 288°C, IPC-TM-650 2.4.41; average expansion over the interval, not necessarily linear. Source |
| Thermal coefficient of dielectric constant | -262 ppm/°C | Typical; -50°C to 150°C, IPC-TM-650 2.5.5.5 (modified temperature measurement); 10 GHz. Source |
| Water absorption | 0.02 % | Typical; D48/50, IPC-TM-650 2.6.2.1. Source |
| Density | 2.6 g/cm³ | Typical; 23°C, ASTM D792. Source |
Typical reported values are not a purchase specification. Process Dk, design Dk and values measured at different frequencies are not interchangeable.
Selection and design notes
- Consider it for compact filters, matching networks and coupled structures when footprint is limiting. Recalculate gaps and coupling as well as line length; higher permittivity changes field distribution and the significance of geometric tolerances.
- The product datasheet's Design Dk is 6.50 over 8–40 GHz, while the selector shows 6.4. Use the explicit source observation and validate the circuit model instead of silently mixing revisions.
Thickness and copper options
Choose a listed RO3006 core thickness and its tolerance; do not assume all RO3000 grades share every thickness or panel size.
Specify the ordered foil and weight. Copper treatment remains part of the RF model and bonding process.
Fabrication considerations
- RO3000 grades share useful processing characteristics, but the fabricator should still qualify the selected core, drilled features and bonding sequence. For homogeneous multilayers, match the bondply grade to the electrical design and confirm the final bonded spacing.
Application fit
- Compact microwave filters
- RF matching
- High-Dk PTFE multilayers
Limits and substitution checks
- The substantial negative temperature coefficient makes room-temperature tuning an incomplete qualification. Model or measure frequency movement over the operating range, especially for narrowband filters. This grade is not an automatic substitute for RO4360G2 merely because their process Dk labels look similar.