RO3210 is the high-Dk, woven-glass-reinforced member of the RO3200 group. It targets designs that need compact distributed RF features while keeping reinforcement in the PTFE composite. Its dielectric tolerance and temperature coefficient deserve particular attention when the application is narrowband or geometrically constrained.
Material system
Ceramic-filled PTFE reinforced with woven glass
Technical properties
| Property | Reported value | Conditions / source |
|---|---|---|
| Process dielectric constant | 10.20 ± 0.50 | Typical, 10 GHz, 23°C; IPC-TM-650 2.5.5.5 clamped stripline; thickness direction. Source |
| Design dielectric constant | 10.8 | Typical, 8–40 GHz; differential phase length method. Average across the common constructions in the cited datasheet. Source |
| Dissipation factor | 0.0027 | Typical, 10 GHz, 23°C; IPC-TM-650 2.5.5.5; thickness direction. Source |
| Thermal conductivity | 0.81 W/(m·K) | Typical; ASTM C518, 80°C; through-thickness thermal conduction. Source |
| CTE, X axis | 13 ppm/°C | Typical; -55°C to 288°C, IPC-TM-650 2.4.41; average expansion over the interval, not necessarily linear. Source |
| CTE, Y axis | 13 ppm/°C | Typical; -55°C to 288°C, IPC-TM-650 2.4.41; average expansion over the interval, not necessarily linear. Source |
| CTE, Z axis | 34 ppm/°C | Typical; -55°C to 288°C, IPC-TM-650 2.4.41; average expansion over the interval, not necessarily linear. Source |
| Thermal coefficient of dielectric constant | -459 ppm/°C | Typical; 0°C to 100°C, IPC-TM-650 2.5.5.5 (modified temperature measurement); 10 GHz. Source |
Typical reported values are not a purchase specification. Process Dk, design Dk and values measured at different frequencies are not interchangeable.
Selection and design notes
- Consider it when both miniaturization and reinforcement are required, then compare a realistic layout with RO3010 or a high-Dk thermoset alternative. The useful choice depends on tolerance and process capability, not only the highest listed Dk.
- A small resonator can become difficult to tune if etch variation dominates its dimensions. Include gap, line-width and dielectric variation in the evaluation before deciding that the smallest layout is preferable.
Thickness and copper options
Verify grade-specific thickness and tolerance against the product table; very small RF geometries can amplify dielectric-spacing variation.
Require the actual foil construction in any comparison or substitution, including base versus finished plated copper.
Fabrication considerations
- Obtain the fabricator's reinforced-PTFE drilling and plated-hole process and identify the exact bonding materials. Review local glass effects for narrow RF features, particularly where phase matching or symmetric coupling is more important than average impedance.
Application fit
- Miniaturized microwave circuits
- Reinforced high-Dk boards
- Compact filters
Limits and substitution checks
- The relatively strong negative dielectric temperature coefficient makes a room-temperature match insufficient for a temperature-stable filter. RO3210 is not an interchangeable reinforced version of RO3010; Design Dk, loss, moisture and mechanical response all have their own observations.