RO4360G2 is a higher-permittivity thermoset option for designers who want more compact distributed RF features while retaining the RO4000 processing route. Its ceramic loading changes both electrical dimensions and mechanical behavior relative to RO4350B. The listed process and Design Dk values should remain separate in a material model.
Material system
Ceramic-filled hydrocarbon thermoset reinforced with woven glass
Technical properties
| Property | Reported value | Conditions / source |
|---|---|---|
| Process dielectric constant | 6.15 ± 0.15 | Process specification as labelled in the product datasheet; 10 GHz and 2.5 GHz, 23°C, Z direction; IPC-TM-650 2.5.5.5 clamped stripline. Source |
| Design dielectric constant | 6.4 | Typical value stated in datasheet overview and selector guide. Selector footnote 11 describes thick-microstrip determination; product table does not provide a separate frequency for Design Dk. Source |
| Dissipation factor | 0.0038 | Typical, 10 GHz, 23°C; IPC-TM-650 2.5.5.5; direction is not separately recorded here. Source |
| Thermal conductivity | 0.75 W/(m·K) | Typical; ASTM D5470, 50°C, through-thickness direction. Source |
| Thermal coefficient of dielectric constant | -131 ppm/°C | Typical; -50°C to 150°C, IPC-TM-650 2.5.5.5 (modified temperature measurement); 10 GHz. Source |
Typical reported values are not a purchase specification. Process Dk, design Dk and values measured at different frequencies are not interchangeable.
Selection and design notes
- Use it to investigate smaller matching networks or compact resonators when board area is constrained. Higher Dk shortens electrical wavelength, but that benefit must be balanced against tighter geometry sensitivity and the actual loss budget.
- Compare it with high-Dk PTFE or TMM alternatives using a representative circuit, because equivalent nominal permittivity does not establish equal thermal drift or fabrication behavior.
Thickness and copper options
Standard dielectric offerings listed by Rogers include 8, 16, 20, 24, 32 and 60 mil; use the corresponding tolerance.
18 and 35 µm ED copper are listed. Resistive-foil availability and the selected foil finish require confirmation.
Fabrication considerations
- Discuss drilling, copper adhesion and RO4460G2 or other qualified bonding options before freezing a multilayer design. The laminate datasheet is not a complete lamination recipe, and the prepreg contributes its own thickness and electrical response.
Application fit
- Compact RF networks
- Small-cell transceivers
- Power-amplifier matching
Limits and substitution checks
- A smaller resonator is not automatically a better resonator. Manufacturing tolerances become a larger part of the allowed tuning range as features shrink; run a geometry and Dk tolerance study before claiming a footprint saving with unchanged RF performance.