RO4460G2 is a higher-Dk ceramic-filled thermoset bonding material in the RO4400 group. It is relevant when a multilayer design needs a bonding dielectric closer to higher-permittivity RF cores such as RO4360G2. Its identity is the adhesive construction, not a substitute copper-clad core.
Material system
Ceramic-filled hydrocarbon thermoset prepreg with woven glass
Technical properties
| Property | Reported value | Conditions / source |
|---|---|---|
| Process dielectric constant | 6.15 ± 0.15 | Typical; 10 GHz, 23°C/50% RH; IPC-TM-650 2.5.5.5 clamped stripline; direction is not separately recorded here. Source |
| Dissipation factor | 0.004 | Typical; 10 GHz, 23°C/50% RH; IPC-TM-650 2.5.5.5; direction is not separately recorded here. Source |
| Thermal conductivity | 0.67 W/(m·K) | Typical; ASTM D5470, 80°C, through-thickness direction. Source |
| Water absorption | 0.05 % | Typical; D24/23, IPC-TM-650 2.6.2.1; current product sheet. Source |
Typical reported values are not a purchase specification. Process Dk, design Dk and values measured at different frequencies are not interchangeable.
Selection and design notes
- Consider it when the fields and electrical spacing of a high-Dk multilayer make a lower-Dk bondline undesirable. Model each dielectric region and verify the actual resin distribution around patterned copper before simplifying the stack to one homogeneous medium.
- A matched nominal Dk can help a design objective, but it does not prove that all modes or discontinuities behave like a monolithic core. Use representative structures to check the relevant coupling and phase.
Thickness and copper options
Choose the listed prepreg construction and confirm final pressed spacing using actual copper density and thickness.
Unclad bonding material; compatible CU4000/LoPro foil options must be specified separately.
Fabrication considerations
- Discuss resin flow, cure and surface treatment using the RO4400 guidance and the selected core. Confirm compatibility with the entire thermal sequence, particularly if sequential laminations or a metal carrier impose additional exposure.
Application fit
- High-Dk RF multilayers
- RO4360G2 bonding
- Compact stripline assemblies
Limits and substitution checks
- The grade's properties and thermal behavior are not identical to RO4450F. A shared prepreg family does not justify borrowing another grade's Tg or press recipe. The current moisture-test observation also differs from the selector summary, so the exact source conditions remain important.