RT/duroid 6006 is a higher-permittivity ceramic-filled PTFE laminate for compact microwave structures. It offers a different thermal and mechanical balance from RO3006 even though both share a similar process Dk. A designer should treat the two as separate qualified materials, not as alternate spellings for one dielectric.
Material system
Ceramic-filled PTFE
Technical properties
| Property | Reported value | Conditions / source |
|---|---|---|
| Process dielectric constant | 6.15 ± 0.15 | Typical, 10 GHz, 23°C; IPC-TM-650 2.5.5.5 clamped stripline; direction is not separately recorded here. Source |
| Design dielectric constant | 6.45 | Typical, 8–40 GHz; differential phase length method. Average across the common constructions in the cited datasheet. Source |
| Dissipation factor | 0.0027 | Typical, 10 GHz, 23°C; IPC-TM-650 2.5.5.5; direction is not separately recorded here. Source |
| Thermal conductivity | 0.49 W/(m·K) | Typical; ASTM C518, 80°C; through-thickness thermal conduction. Source |
| Thermal coefficient of dielectric constant | -410 ppm/°C | Typical; -50°C to 170°C, IPC-TM-650 2.5.5.5 (modified temperature measurement); 10 GHz. Source |
Typical reported values are not a purchase specification. Process Dk, design Dk and values measured at different frequencies are not interchangeable.
Selection and design notes
- Use it when compact resonators or matching circuits justify the higher permittivity. Verify coupling and manufacturable gaps before assigning a footprint advantage to the material.
- Its Design Dk over 8–40 GHz is distinct from the process-test value. Starting from the correct observation helps explain why a resonator designed with a catalogue acceptance number may need a systematic length correction.
Thickness and copper options
The current datasheet lists nominal 25, 50 and 75 mil cores with grade-specific tolerances.
ED copper is standard in the table; heavy-metal, resistive-foil or unclad options require explicit configuration confirmation.
Fabrication considerations
- The RT/duroid 6000 fabrication guidance is the starting reference for mechanical processing and bonding. Ask the fabricator to consider the high-filled PTFE construction when choosing drills, routing and plated-hole preparation, especially on mechanically constrained carriers.
Application fit
- Compact microwave filters
- Patch antennas
- High-Dk matching circuits
Limits and substitution checks
- The large negative dielectric temperature coefficient can shift narrowband circuits materially across temperature. Evaluate the complete resonator drift rather than treating miniaturization as a free benefit. Do not transfer a generic high-Dk laminate's lamination, reflow or thermal-property assumptions to this grade.