RT/duroid 6010.2LM is a high-permittivity ceramic-filled PTFE laminate relevant to compact RF structures. The currently retrieved product datasheet has changed several values compared with the selector, including dielectric loss and thermal response. This record uses that grade-specific sheet for its numeric observations and makes the conflict visible.
Material system
Ceramic-filled PTFE
Technical properties
| Property | Reported value | Conditions / source |
|---|---|---|
| Process dielectric constant | 10.20 ± 0.25 | Typical, 10 GHz, 23°C; IPC-TM-650 2.5.5.5 clamped stripline; direction is not separately recorded here. Source |
| Dissipation factor | 0.0025 | Typical, 10 GHz, 23°C; IPC-TM-650 2.5.5.5; direction is not separately recorded here. Source |
| Thermal conductivity | 0.86 W/(m·K) | Typical, through thickness; ASTM D5470. The product table does not state test temperature. Source |
| CTE, X axis | 25 ppm/°C | Typical; -55°C to 288°C, IPC-TM-650 2.4.24; current product datasheet. Source |
| CTE, Y axis | 25 ppm/°C | Typical; -55°C to 288°C, IPC-TM-650 2.4.24; current product datasheet. Source |
| CTE, Z axis | 41 ppm/°C | Typical; -55°C to 288°C, IPC-TM-650 2.4.24; current product datasheet. Source |
| Thermal coefficient of dielectric constant | -375 ppm/°C | Typical; -50°C to 150°C, IPC-TM-650 2.5.5.5 (modified temperature measurement); 10 GHz. Source |
| Water absorption | 0.05 % | Typical; D48/50, IPC-TM-650 2.6.2.1, current product sheet. Source |
Typical reported values are not a purchase specification. Process Dk, design Dk and values measured at different frequencies are not interchangeable.
Selection and design notes
- Consider it when distributed circuit size is the primary constraint, then evaluate the resulting trace widths, coupling gaps and tuning margin. A higher Dk design may save area while becoming more sensitive to etching and dielectric spacing.
- For an existing design, preserve the material revision and measured response before comparing a newer supply batch or an alternative high-Dk laminate.
Thickness and copper options
The current sheet lists 25, 50 and 75 mil nominal cores. Retain the inch dimensions where paired metric text is inconsistent.
Confirm ED foil weight or any special cladding against the actual order; do not assume old constructions remain identical.
Fabrication considerations
- Use the applicable RT/duroid fabrication instructions and obtain supplier confirmation of the offered grade and revision. Make a representative resonator or impedance coupon to resolve electrical modelling assumptions, particularly when moving between old and new published data.
Application fit
- Miniaturized RF filters
- High-Dk antennas
- Legacy high-permittivity designs
Limits and substitution checks
- The current sheet reports Df 0.0025 and a dielectric temperature coefficient of -375 ppm/°C, whereas the selector gives older different values. The selector's Design Dk is not silently paired with the new sheet; obtain construction-specific design data before relying on an automatic model.