RO3003G2 is a ceramic-filled PTFE development targeted at thin millimeter-wave circuits, with a refined filler system and VLP ED copper. Its process Dk remains close to RO3003, but its documented 77 GHz Design Dk and copper construction are different. Those differences matter more than the shared beginning of the product name.

Material system

Ceramic-filled PTFE

Technical properties

RO3003G2 — reported properties and conditions
PropertyReported valueConditions / source
Process dielectric constant3.00 ± 0.04Typical, 10 GHz, 23°C; IPC-TM-650 2.5.5.5 clamped stripline; thickness direction. Source
Design dielectric constant3.07Typical; 77 GHz, microstrip differential phase length method. Do not relabel this observation as a 10 GHz measurement. Source
Dissipation factor0.0011Typical, 10 GHz, 23°C; IPC-TM-650 2.5.5.5; thickness direction. Source
Thermal conductivity0.43 W/(m·K)Typical; ASTM D5470, 50°C, through-thickness direction. Source
Thermal coefficient of dielectric constant-35 ppm/°CTypical; -50°C to 150°C, IPC-TM-650 2.5.5.5 (modified temperature measurement); 10 GHz. Source
Water absorption0.06 %Typical; D48/50, IPC-TM-650 2.6.2.1. Source
Density2.15 g/cm³Typical; 23°C, ASTM D792. Source

Typical reported values are not a purchase specification. Process Dk, design Dk and values measured at different frequencies are not interchangeable.

Selection and design notes

  • Consider it for a thin radar antenna or feed layer where dielectric uniformity, low conductor-profile loss and small drilled features are relevant. Compare it with original RO3003 using the intended thickness and foil rather than a catalogue-only comparison.
  • The 77 GHz Design Dk is an appropriate starting observation for that test regime. It is not a claim that the same value models every transmission-line geometry without calibration.

Thickness and copper options

The datasheet lists 5 and 10 mil dielectric thicknesses, with separate tolerances. Thin-core geometry should be used directly in the solver.

Standard cladding is VLP ED copper, with 18 µm listed. Other foil weights require configuration confirmation.

Fabrication considerations

  • Use the RO3000 fabrication guidance with the G2-specific modifications and require the fabricator to identify its PTFE hole preparation. Verify small-via quality and etch control on the actual RF cap layer before scaling an array design.

Application fit

  • 77 GHz radar
  • Thin millimeter-wave feeds
  • Radar antenna arrays

Limits and substitution checks

  • The published low insertion-loss example belongs to a particular thin microstrip construction. It cannot be substituted for total board loss or a sensor range specification. The 10 GHz Df observation must likewise not be described as a measured 77 GHz dielectric-loss value.

Technical sources