XtremeSpeed RO1200 laminate is a ceramic-filled PTFE material with spread woven-glass reinforcement for high-speed interconnects. It is distinct from RO1200 Bondply, which performs the bonding function in a multilayer structure. The current laminate sheet gives its own dielectric observation rather than the wider selector summary range.
Material system
Ceramic-filled PTFE reinforced with spread woven glass
Technical properties
| Property | Reported value | Conditions / source |
|---|---|---|
| Process dielectric constant | 3.05 | Typical, 10 GHz, 23°C; IPC-TM-650 2.5.5.5 clamped stripline; direction is not separately recorded here. Source |
| Design dielectric constant | 3.05 | Typical; 1–20 GHz, differential phase length method, Z direction; average over common thicknesses. Source |
| Dissipation factor | 0.0017 Max | Maximum as explicitly labelled in the product datasheet; 10 GHz, 23°C, Z direction, IPC-TM-650 2.5.5.5. It is not a measured typical loss guarantee for a finished channel. Source |
| Thermal conductivity | 0.42 W/(m·K) | Typical, through thickness; ASTM D5470. The product table does not state test temperature. Source |
| CTE, X axis | 8 ppm/°C | Typical; -55°C to 288°C, IPC-TM-650 2.4.41; average expansion over the interval, not necessarily linear. Source |
| CTE, Y axis | 8 ppm/°C | Typical; -55°C to 288°C, IPC-TM-650 2.4.41; average expansion over the interval, not necessarily linear. Source |
| CTE, Z axis | 30 ppm/°C | Typical; -55°C to 288°C, IPC-TM-650 2.4.24, Z direction; product datasheet. Source |
| Water absorption | 0.03 % | Typical; E1/105 + D48/50, IPC-TM-650 2.6.2.1. Source |
| Density | 2.1 g/cm³ | Typical; C-24/23/50, ASTM D792. Source |
Typical reported values are not a purchase specification. Process Dk, design Dk and values measured at different frequencies are not interchangeable.
Selection and design notes
- Consider it for demanding channels where dielectric and conductor loss, skew and interconnection geometry require coordinated control. Evaluate the channel's length and rise-time spectrum rather than assigning a universal data-rate capability to the material.
- Spread reinforcement can help address local structure, but actual differential-pair placement and routing still matter. Use construction-specific skew and loss evaluation for the intended channel geometry.
Thickness and copper options
Standard cores span 3–10 mil in the listed thickness steps; confirm the tolerance and construction for each layer.
Reverse-treated ED and rolled options are described. Match copper to the channel-loss and skew assumptions.
Fabrication considerations
- A PTFE-capable fabrication process is required, along with an identified compatible bonding system. Define the chosen core thickness, foil and final dielectric spacing so that the signal-integrity model represents the manufactured stackup.
Application fit
- High-speed backplanes
- Router and switch interconnects
- High-performance computing boards
Limits and substitution checks
- The datasheet labels 0.0017 as a maximum Df at 10 GHz, unlike many typical entries in the library. That value is not a guarantee of channel insertion loss. RO1200 laminate and its bondply also have different dielectric values, so a multilayer cannot be represented by one anonymous RO1200 medium.